Surface preparation before chemical copper plating of holes in printed circuit boards. Part I

• N.S. Grigoryan, S.A. Savitskaya, N.A. Asnis, O.I. Bardina, A.A. Abrashov, T.A. Vagramyan and A.Yu. Dragunova

Mendeleev University of Chemical Technology of Russia, Miusskaya pl. 9, 125047 Moscow, Russian Federation

Abstract: As part of import substitution research, the Innovative Materials and Corrosion Protection Department of D. Mendeleev University (MUCT) has developed a formulation for the cleaning-conditioning stage of the chemical copper plating process used in the production of printed circuit boards. The formulations contain 2.4 g/L monoethanolamine, 0.6 g/L K1 (quaternary ethoxylated alkylamine), and 0.6 g/L of a mixture of oxyethylated synthetic higher fatty alcohols (C₁₂–C₁₄ fractions), which makes it possible to recharge the dielectric surface and, at the same time, clean the copper surface of foiled fiberglass under the following process parameters: t = 50–55°C, τ = 5–10 min. It has been shown that the developed formulations are not inferior to foreign analogs, neither in terms of the process characteristics nor in the properties of the chemical copper coatings obtained.

Keywords: printed circuit board (PCB), metallization of PCB holes, conditioning of the dielectric, chemical copper plating of PCB holes, surface preparation before metallization, micro etching of foiled dielectric material

Int. J. Corros. Scale Inhib., 2022, 11, no. 4, 1593-1603
doi: 10.17675/2305-6894-2022-11-4-11

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