Protection of copper with IFKhAN-125 chamber corrosion inhibitor

• A.A. Shishkin^1,2, A.Yu. Luchkin¹, O.A. Goncharova¹, O.V. Tripachev¹, A.V. Kuzov¹, S.S. Vesely¹, N.N. Andreev¹, Ta Thu Trang³ and T.A. Vagramyan²

¹ Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences, 31-4, Leninsky prospect, 119071 Moscow, Russia
² Mendeleev University of Chemical Technology, Russia, Moscow, Miusskaya sq., 9, 125047 Moscow, Russia
³ Institue of Tropical materials- Vietnam Russia Tropical center, 63 Nguyen Van Huyen, Nghia Do, Ha Noi, Vietnam

Abstract: The effect of hot vapors of an octadecylamine–benzotriazole mixture (IFKhAN-125) on the corrosion resistance of monolithic copper and electroplated copper coating was studied. It was found that the inhibitor efficiently suppresses the initiation of corrosion of both materials in fog spray. Optimal conditions for chamber treatment of copper are 20 min at 150°C. This mode enables the formation of a stable protective film without disturbing the decorative properties of the surface. It was shown that IFKhAN-125 forms films on the copper surface, which reduce the active metal surface area and stabilize its passive state.

Keywords: copper, corrosion resistance, chamber treatment, octadecylamine, benzotriazole, voltammetry, electrochemical impedance spectroscopy

Int. J. Corros. Scale Inhib., 2025, 14, no. 4, 2255-2266
doi: 10.17675/2305-6894-2025-14-4-27

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