International Journal of Corrosion and Scale Inhibition
Investigating inhibitor influence on pickling tin metal resist from copper conductors of printed circuit boards
- Yu.I. Kapustin, A.G. Kholodkova and T.A. Vagramyan
D. Mendeleev University of Chemical Technology of Russia, Miusskaya sq. 9, 125047 Moscow, Russian FederationAbstract: The inhibitor influence on nitric acid pickling printed circuit boards for removing the tin metal resist from copper conductors has been investigated. The proposed pickling solution has high selectivity in solving galvanic tin as compared to copper and it can be corrected easily.
Keywords: inhibitors; printed circuit boards; tin metal resist; pickling solution; nitric acid
Int. J. Corros. Scale Inhib., , 7, no. 1, 1-8 PDF (1 264 K)
doi: 10.17675/2305-6894-2018-7-1-1
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References:
1. S. Cambell, Composition and method for stripping tin and tin-lead from copper surfaces, U.S. Patent No. 5,911,907.
2. J. Jokinen, D.O. Trambitas, R. Penners and G.-J. Witkamp, A method for precipitating metal oxides from an aqueous waste solution, EC Patent WO2007042611 A1.
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