Environmentally friendly synthesis and characterization of copper nanoparticles using amino acids as capping agents: enhanced corrosion resistance and morphological control

• N. Muneam¹, F.F. Sayyid¹, M.H.H. Al-Kaabi² and A.A. Alamiery^3,4

¹ Department of Production Engineering and Metallurgical, University of Technology, Baghdad, 10001, Iraq
² Basrah University for Oil and Gas, Basrah, 61004, Iraq
³ University of Technology, Baghdad, 10001, Iraq
⁴ University Kebangsaan Malaysia, Bangi 43000, Selangor, Malaysia

Abstract: This research presents the synthesis and characterization of copper nanoparticles employing amino acids, specifically L-arginine and L-aspartic acid, as capping agents at varying concentrations (0.25, 0.50, 0.75 and 1 g). The study aims to modify corrosion resistance, crystal size, and surface morphology through electrodeposition using a solution containing CuSO₄ and additives. Prior to the addition of amino acids, the influences of copper concentration and H₂SO₄ concentration on the apparent density, shape, and particle size of the resulting powder were investigated. Characterization techniques, including XRD pattern analysis, FE-SEM scanning electron microscopy, dynamic light scattering (DLS), zeta potential, and FTIR, were employed. The scanning electron microscopy images revealed well-distributed particles with an average size of approximately 30 nm. Additionally, the research explores the impact of camel saliva as an additive on the morphology and particle size of copper powder during the electrodeposition process. The overarching objective is to identify non-toxic and environmentally friendly leveling agents, with a focus on utilizing amino acids for an in-depth investigation into the copper dissolution reaction. This understanding contributes to elucidating the redox reactions involved when metals dissolve in strong acids, providing insights into the development of inhibitory materials that yield nanoscale sizes. Such nanomaterials find applications in diverse fields, including medicine, electronics, and industry.

Keywords: corrosion, saliva, electrodeposition, copper, sulphate

Int. J. Corros. Scale Inhib., 2024, 13, no. 1, 288-310
doi: 10.17675/2305-6894-2024-13-1-14

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